Modeling of power/ground plane noise in high speed digital electronics packaging

摘要

A new model for the simulation of power/ground plane noise which is simple in principle, accurate in its solutions, and applicable to various levels of high-speed digital electronics packaging, is given. It is found that one can obtain accurate modeling of delta-I noise in power and ground planes without resorting to full-wave electromagnetic modeling. Sample results of the simulated delta-I noise with the method are shown.