Polyimide for thin film redistribution on glass-ceramic/copper multilevel substrates (ES9000 system)

摘要

In 1991 IBM introduced a glass-ceramic substrate with thin-film redistribution as the first level package utilizing copper thin-film technology. The authors describe the development of a unique and novel polyimide, a derivative of PMDA-ODA, used in this substrate. The synthesis, processing, and material characterization are described. The discussion emphasizes the experimental techniques developed to fully characterize thin films (10-20 mu m thick) of polyimide to ensure the manufacturability and reliability of the thin-film redistribution.