首页> 外文会议>Electronic Components and Technology Conference, 1992. Proceedings., 42nd >Polyimide for thin film redistribution on glass-ceramic/copper multilevel substrates (ES9000 system)
【24h】

Polyimide for thin film redistribution on glass-ceramic/copper multilevel substrates (ES9000 system)

机译:聚酰亚胺,用于在玻璃陶瓷/铜多层基板上进行薄膜重新分布(ES9000系统)

获取原文

摘要

In 1991 IBM introduced a glass-ceramic substrate with thin-film redistribution as the first level package utilizing copper thin-film technology. The authors describe the development of a unique and novel polyimide, a derivative of PMDA-ODA, used in this substrate. The synthesis, processing, and material characterization are described. The discussion emphasizes the experimental techniques developed to fully characterize thin films (10-20 mu m thick) of polyimide to ensure the manufacturability and reliability of the thin-film redistribution.
机译:1991年,IBM引入了一种玻璃陶瓷基板,薄膜再分配是利用铜薄膜技术的第一级封装。作者描述了在该基材中使用的独特和新型聚酰亚胺的开发,PMDA-ODA的衍生物。描述了合成,处理和材料表征。讨论强调开发的实验技术,以完全表征薄膜(10-20μm厚)的聚酰亚胺,以确保薄膜再分配的可制造性和可靠性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号