首页> 外文会议>Electronic Components and Technology Conference, 1992. Proceedings., 42nd >Solderless high-density interconnects for burn-in applications
【24h】

Solderless high-density interconnects for burn-in applications

机译:适用于老化应用的无焊高密度互连

获取原文

摘要

The development and evaluation of a high-contact-density burn-in socket for a pinless module with 1156 terminals and an intended useful life of at least 1000 h at 200 degrees C are described. Characterization and stress data for wire button contacts realized in various metallurgies along with results for elastomer contacts are presented. Contact integrity and resistance were monitored while under temperature and current accelerated stress. A molybdenum wire button prototype socket was successfully constructed and stress tested.
机译:描述和开发了一种高接触密度老化插座,该插座用于具有1156个端子的无针模块,并且在200摄氏度下的预期使用寿命至少为1000小时。给出了在各种冶金中实现的金属丝按钮触头的特性和应力数据,以及弹性体触头的结果。在温度和电流加速应力下监测触点的完整性和电阻。钼线按钮原型插座已成功构建并进行了压力测试。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号