Rapid prototyping of multichip packages using computer-controlled, ink jet direct-write

摘要

A preliminary study is described that shows the feasibility of rapid prototyping for the multichip packages. This can ease the prototyping bottleneck in the multichip packaging process. A model of the ink-jet direct-write system was developed, and various inks were studied. It was found that liquid photoresist inks have the most promise. Well-defined interconnection patterns among chips can be obtained by writing the photoresist inks directly on metal-coated substrates and following with a metal film etching method. Conductive metal lines of 2 mil. in width or smaller can be achieved.