首页> 外文会议>IEEE Electronic Components and Technology Conference >Wideband Low-profile AMC-based Patch Antenna for 5G Antenna-in-package Application
【24h】

Wideband Low-profile AMC-based Patch Antenna for 5G Antenna-in-package Application

机译:适用于5G封装内天线的宽带薄型基于AMC的贴片天线

获取原文

摘要

A wideband low-profile AMC-based patch antenna is proposed in this paper. The novel antenna is composed of a center patch and finite sized AMC cells with microstrip line or embedded strip line methods. The antenna-in-package concepts based on the proposed antenna are introduced. The performance of proposed antenna with two feeding methods is detailed investigated. A prototype to verify the proposed AMC-based patch antenna fed by microstrip line was successfully fabricated with a compact size of 1.2 λ0×1.2 λ0×0.05 λ00 is the free space wavelength at 28 GHz). The measured results demonstrate that a wide impedance bandwidth of 17% for |S11| below -10 dB is achieved from 26.9 GHz to 31.9 GHz, and a peak gain of 7.43 dBi is obtained at 31.3 GHz. The proposed antenna and its AiP concepts are fully compatible with the state-of-the-art substrate manufacturing process and high data rate demands for 5G millimeter wave application.
机译:本文提出了一种基于宽带薄型AMC的贴片天线。新型天线由中心贴片和有限尺寸的AMC单元组成,采用微带线或嵌入式带状线方法。介绍了基于所提出的天线的封装天线概念。详细研究了所提出的两种馈电方式的天线性能。成功制造了一个原型,以验证由微带线馈电的基于AMC的贴片天线,该原型的紧凑尺寸为1.2λ 0 ×1.2λ 0 ×0.05λ 0 (λ 0 是28 GHz的自由空间波长)。测量结果表明| S的阻抗带宽为17% 11 |在26.9 GHz至31.9 GHz范围内可达到-10 dB以下的峰值,在31.3 GHz处可获得7.43 dBi的峰值增益。拟议的天线及其AiP概念与最新的基板制造工艺以及5G毫米波应用对高数据速率的要求完全兼容。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号