Development of Mold-First Fan-Out Panel-Level Packaging (FO-PLP) on 600mm x 600mm Size Panel

摘要

In this Paper, Mold-First FO PLP integration has been demonstrated on large panel size of 600mm x 600mm. Mold-First fan-out package test vehicle (TV) of 10mm x 10mm size has been designed with single chip size of 7mm x 7mm and one layer RDL of 10μm LW/LS. Various molding compounds such as granular, liquid and sheet type are evaluated for panel reconstruction process and selected granular mold material for Mold-First FO PLP integration. Panel reconstruction processes such as mold tape lamination, dies pick and place, panel level molding, post mold curing (PMC) and carrier de-bonding are optimized. Die shift at panel level has been characterized on reconstructed panels fabricated using optimized processes and established die shift compensation method to improve the die shift. Reconstructed panel with die shift compensation achieved die shift of as low as 10μm at panel center and 60μm at panel edge compared to the die shift of 324μm at panel edge of reconstructed panel without compensation. RDL fabrication on reconstructed panel has been demonstrated using positive tone photoresist and polyimide dielectric materials, and optimized processes. Panel warpage is characterized at various stages of MoldFirst FO PLP integration and the maximum warpage of panel during whole integration is 2mm. Mold-First FO PLP samples are passed component level Moisture Sensitivity Test Level 3 (MST L3) and un-biased Highly Accelerated Stress Test (Un-biased HAST).