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A Novel Real-Time Junction Temperature Monitoring Circuit for SiC MOSFET

机译:一种新型的SiC MOSFET实时结温监测电路

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Junction temperature is a critical parameter for indicating the health condition of power devices in converters. Temperature sensitive electrical parameters (TSEPs) provide a viable method for extracting junction temperature of power devices in real-time operation. However, a few studies focus on practical implementations methods for SiC devices. This paper proposed a novel real-time junction temperature monitoring circuit for SiC MOSFET based on its quasi-threshold voltage (quasi-Vth) without complex circuits and current sensors. Furthermore, the effects of load current and DC bus voltage on junction temperature of SiC MOSFET extraction are analyzed. The experimental result shows that the quasi-Vth of SiC MOSFET extracted by the proposed measurement circuit has a sensitivity of -4.37mV/°C and is independent of load current.
机译:结温是指示转换器中功率设备的健康状况的关键参数。温度敏感的电参数(TSEP)提供了一种可行的方法,用于在实时操作中提取功率器件的结温。然而,一些研究集中在SiC器件的实际实现方法上。本文基于准阈值电压(准V),提出了一种新型的SiC MOSFET实时结温监测电路 ),而无需复杂的电路和电流传感器。此外,分析了负载电流和直流母线电压对SiC MOSFET提取结温度的影响。实验结果表明,准V 所提出的测量电路提取的SiC MOSFET的灵敏度为-4.37mV /°C,并且与负载电流无关。

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