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Nucleation in the Process of Cu-Sn Alloy Nanoscale Films Electrodeposition

机译:Cu-Sn合金纳米薄膜电沉积过程中的成核

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The results of a study of nucleation and growth of nuclei in polyligand pyrophosphate-trilonate electrolyte for Cu-Sn alloy deposition are presented. It is shown that the current transients obtained in a wide range of alloy deposition potentials correspond to the model of instantaneous formation of 3D crystals with diffusion control. The number of nuclei N increases from 0.19,108 cm-2 to 2.05,108 cm-2 with increase in polarization of the electrode. The thickness of continuous films is in the range of 3.6–10.2 nm depending on their deposition potential.
机译:给出了研究聚配体焦磷酸盐-三氟甲磺酸盐用于Cu-Sn合金沉积的成核和核生长的研究结果。结果表明,在广泛的合金沉积电位范围内获得的电流瞬变与具有扩散控制的3D晶体的瞬时形成模型相对应。随着电极极化的增加,核N的数量从0.19,108 cm-2增加到2.05,108 cm-2。连续膜的厚度在3.6-10.2 nm范围内,具体取决于其沉积电位。

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