Influence of Average Current Density and Pulse Frequency on Morphology and Structure of Pulse-reverse Current Electroplated Ni Plating

摘要

Three-dimensional (3D) integration sets improved requirements on the structure and performance of the Ni deposits. Pulse reverse current (PRC) electroplating is regarded as a promising technique to obtain Ni plating fulfilling such requirements. This work investigated the influence of two PRC parameters, average current density and pulse frequency, on surface morphology and grain size of the Ni deposits. Ni deposits were prepared by first direct current (DC) pre-plating and then PRC electroplating process of given average current density and pulse frequency. Scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) were employed to characterize the deposits. It was found that the surface morphology and grain size of the Ni deposits were significantly influenced by average current density and pulse frequency. Such results are instructive in the electroplating obtainment of Ni for packaging applications.