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Design of Antenna-in-Package in 5G Communication Band Based on LTCC Technology

机译:基于LTCC技术的5G通信频段封装天线设计

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摘要

Antenna-in-Package(AiP) technology has an advantage that a system can maintain antenna performance while being small in size and highly integrated. In this paper, based on LTCC technology, a rectangular corner cut microstrip antenna for 5G communication band is designed, and then integrated into a package of the chip with AiP technology. The simulation results of HFSS software show that after miniaturized and highly integrated, the AiP system achieves the goal with operation frequency of 4.8 ~ 4.9GHz, bandwidth of 100MHz and the peak gain of 6.52dB.
机译:封装天线(AiP)技术的优点是,系统可以保持天线性能,同时体积小且高度集成。本文基于LTCC技术,设计了用于5G通信频段的矩形角切微带天线,然后将其集成到采用AiP技术的芯片封装中。 HFSS软件的仿真结果表明,经过小型化和高度集成,AiP系统达到了4.8〜4.9GHz的工作频率,100MHz的带宽和6.52dB的峰值增益的目标。

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