Feasibility Study of Fan-Out Panel-Level Packaging for Heterogeneous Integrations

摘要

The design, materials, process, and fabrication of a heterogeneous integration of 4 chips by a FOPLP (fan-out panel-level packaging) with chip-first and dies face-down formation are investigated in this study. Emphasis is placed on the application of a new assembly process and materials for fabricating the RDLs (redistribution layers) of the FOPLP. The panel size is 508mm x 508mm. The epoxy molding compound (EMC) is a dry-film material and is molded by lamination method. The minimum metal line width and spacing is 10µm and they are fabricated by printed circuit board (PCB) method and equipment.