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Total Ionizing Dose Effects by alpha irradiation on circuit performance and SEU tolerance in thin BOX FDSOI process

机译:α辐照对薄BOX FDSOI工艺中电路性能和SEU耐受性的总电离剂量效应

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Total ionizing dose (TID) effect is a phenomenon that threatens the reliability of transistors under high-radiation environments. TID is caused by radiation-induced trapped holes in oxide insulator. We evaluated the effects of TID on fully-depleted silicon on insulator (FDSOI) and bulk processes by measuring frequency of a ring oscillator (RO) and single event upset tolerance of flip flops (FFs). On the bulk process, TID induced Vth shift of nMOSFET, leads to increase of the RO frequency. On the FDSOI process, IR drop induced by large amount of leakage current flowing above buried oxide (BOX) layer decreases RO frequency. We also demonstrated that TID effects recovers by thermal annealing.
机译:总电离剂量(TID)效应是一种在高辐射环境下威胁晶体管可靠性的现象。 TID是由氧化物绝缘体中的辐射引起的陷阱孔引起的。我们评估TID的效果上完全耗尽绝缘体上硅(FDSOI)和本体方法通过测量的环形振荡器(RO)和翻转的单粒子翻转公差频率触发器(FF)等。在整体工艺中,TID引起nMOSFET的Vth漂移,导致RO频率增加。在FDSOI工艺中,由大量泄漏电流流过掩埋氧化物(BOX)层上方引起的IR下降会降低RO频率。我们还证明了TID效应可通过热退火恢复。

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