3D Finite Element Model using SIBC to Accelerate Electromagnetic Thermal Simulation of Induction Thermography Technique

摘要

We present a lightened 3D finite element model for coupled electromagnetic thermal simulation of the induction thermography non-destructive testing technique to reduce the computation time. The time harmonic electromagnetic problem is expressed in $ A-phi$ formulation and lightened by using the Surface Impedance Boundary Condition (SIBC) applied to both the massive induction coil surface and the surface of conductor workpiece under test including open cracks. The external circuit is taken into account by using the impressed voltage or the impressed current formulation