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Automatic production test separating system of ASIC with package ID detection

机译:具有封装ID检测功能的ASIC自动生产测试分离系统

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With the continuous development of IC (Integrated Circuit) technology, it has been widely used in all aspects of manufacture, production, consumption and so on, and IC filter as an important part of its production testing is directly related to the quality of IC, and with the wide application of automatic separating system of IC, production testing efficiency and quality was improved greatly. Domestic and international industrial separating systems are mainly developed for mass production and are suitable for civilian products in a single package. Due to its special requirements such as small batch size, multiple varieties, and data traceability, the research institutes ASIC(application-speciflc integrated circuit) is difficult to directly use industrial separating system. At the present time, package ID(identification) number was mainly detected by the naked eye and manual separating method was basically used in China. Therefore, there are many disadvantages such as low efficiency, error-prone, high cost, and the influence of human factors on the quality of IC.Due to the characteristics of the research institutes ASIC production, there are a large number of problems in product separating. In order to improve the production test efficiency and ensure the product quality, an automatic production test separating system of ASIC with package ID number detection has been developed. The system is based on the architecture of the embedded system platform and is mainly composed of the upper computer, the lower computer and the mechanical implementation. First of all, the upper computer software is implemented by the Virtual Basic language in the Virtual Studio platform. Secondly, The lower computer is based on the STM32F407IGH6 of ARM7 architecture, and is implemented by μC/OS III embedded OS(operating system) for mechanical part controlling and host computer interaction. At last, the mechanical part guarantees the test separating of different types of IC through high-magnification cameras, highresolution servo motors and high-precision screw mechanisms. Specially the package ID number detection system is implemented the detection algorithm through the NI-VDM module.Practical application has proved that the system is very stable and reliable, which greatly facilitates the detection of package ID number of IC, greatly reduces or avoids the occurrence of ASIC quality problems, greatly improves the efficiency of production testing, greatly meet the requirements of production, and has far-reaching practical significance.
机译:随着IC(集成电路)技术的不断发展,它已广泛应用于制造,生产,消费等各个方面,而IC滤波器作为其生产测试的重要组成部分直接关系到IC的质量,随着集成电路自动分离系统的广泛应用,生产测试的效率和质量得到了极大的提高。国内外工业分离系统主要是为批量生产而开发的,并且适合于单个包装中的民用产品。由于其特殊的要求,例如小批量,多品种和数据可追溯性,研究机构ASIC(专用集成电路)很难直接使用工业分离系统。目前,包裹ID(识别)号主要通过肉眼检测,并且在中国基本上使用手动分离方法。因此,存在效率低,容易出错,成本高以及人为因素对IC质量的影响等诸多弊端。由于科研院所ASIC生产的特点,产品中存在大量问题分离。为了提高生产测试效率并确保产品质量,已经开发了具有包装ID号检测功能的ASIC自动生产测试分离系统。该系统基于嵌入式系统平台的体系结构,主要由上位机,下位机和机械实现组成。首先,上层计算机软件是通过Virtual Studio平台中的Virtual Basic语言实现的。其次,下位机基于ARM7架构的STM32F407IGH6,并由μC/ OS III嵌入式OS(操作系统)实现,用于机械零件控制和上位机交互。最后,机械部分保证了通过高倍率摄像头,高分辨率伺服电机和高精度螺杆机构对不同类型的IC进行测试分离。特殊的封装ID号检测系统是通过NI-VDM模块实现的检测算法,实际应用证明该系统非常稳定可靠,极大地方便了IC封装ID号的检测,大大减少或避免了IC的封装ID号的检测。 ASIC质量问题的解决,大大提高了生产测试的效率,极大地满足了生产的要求,并具有深远的现实意义。

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