assembling; ball grid arrays; circuit reliability; delamination; elasticity; electronics packaging; encapsulation; failure (mechanical); failure analysis; finite element analysis; fracture; integrated circuit reliability; printed circuit manufacture; reliability; resin;
机译:界面脱层I型预测的粘性区参数选择
机译:PZT薄膜界面分层的粘聚区建模
机译:界面分层的三维自适应内聚区模型
机译:盆地电子器件界面分层的凝聚区建模与损伤预测高G机械冲击
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机译:疲劳脱层速率模拟内聚区模型的改进
机译:PZT薄膜界面分层的粘聚区建模