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A NEW NANOINDENTATION CREEP METHOD USING CONSTANT CONTACT PRESSURE

机译:一种新的纳米狭窄蠕变方法,使用恒定接触压力

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A new indentation creep testing method is proposed where the mean contact pressure is kept constant. An approach of the proposed method is quite different from conventional indentation creep experiments, where the load on the sample is kept constant and the hardness is constantly decreasing due to the increasing contact depth / area. In this newly developed constant contact pressure method (CCP), the mean contact pressure as defined through Sneddon's hardness is kept constant, until a steady state strain rate is achieved. Besides controlling the mean contact pressure, the dynamic stiffness is furthermore used to assess the indentation depth, minimizing thereby thermal drift influence and pile-up or sink-in effects during long-term experiments. The CCP method has been tested on strain rate sensitive ultrafine grained (UFG) CuZn30, UFG CuZn5 as well as on fused silica, comparing the results to strain rate jump (SRJ) tests as well as to the CLH nanoindentation creep tests. With the CCP method strain rates from 5×1 CH s~(-1) down to 5×10~(-6) s~(-1) can be achieved, keeping the mean contact pressure constant over a long period of time, in contrast to the CLH method. Moreover at low contact pressures, the strain rate sensitivity exponent of the tested materials is strongly increasing. There the plastic zone is only slightly increasing an internal relaxation processes within the plastic zone dominate the deformation behaviour. The CCP technique thus offers new possibility of performing long-term creep experiments while retaining the contact stress underneath the tip constant.
机译:提出了一种新的压痕蠕变测试方法,其中平均接触压力保持恒定。所提出的方法的方法与常规压痕蠕变实验完全不同,其中样品上的负载保持恒定,并且由于增加的接触深度/区域,硬度不断地减小。在这种新开发的恒定接触压力法(CCP)中,通过SNEDDON硬度定义的平均接触压力保持恒定,直到实现稳态应变率。除了控制平均接触压力之外,还用于评估压痕深度,从而最小化在长期实验期间的热漂移影响和堆积或下降效果。 CCP方法已经在应变率敏感超细晶粒(UFG)CuzN30,UFG CuzN5以及熔融二氧化硅上进行测试,将结果与应变率跳跃(SRJ)测试的结果进行比较,以及ClH纳米凸缘蠕变试验。通过将5×1 Ch S〜(-1)的CCP方法应变速率降至5×10〜(-6)S〜(-1),可以在很长一段时间内保持平均接触压力恒定,与CLH方法相反。此外,在低接触压力下,测试材料的应变率灵敏度指数强烈增加。在那里,塑料区仅略微增加塑料区内的内部松弛过程,主导变形行为。因此,CCP技术提供了执行长期蠕变实验的新可能性,同时保持尖端恒定下方的接触应力。

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