首页> 外文会议>IEEE International Conference on Electronics, Circuits and Systems >Slicing FIFOs for on-chip memory bandwidth exhaustion
【24h】

Slicing FIFOs for on-chip memory bandwidth exhaustion

机译:切片FIFO用于片上存储器带宽耗尽

获取原文

摘要

Within an MPSoC environment, the delivery of data from one computation stage to the next is often the bottleneck of the overall system performance. Especially in high-speed communication where at least two actors (producer and consumer) need access to the same data, the memory interface is usually the limiting factor. Therefore, many solutions like network on chips, clusters of shared memory, memory hierarchy, etc. have been proposed to transfer data from one actor to another. To avoid using dual port memory macros-which are expensive in terms of chip area-we propose a hardware design where the communication through FIFOs is transparently sliced to a multitude of altering memory banks. This allows simultaneous memory accesses to the same FIFO while using only single port memory macros, thus reducing on-chip area and access delay.
机译:在MPSoC环境中,从一个计算阶段到下一个计算阶段的数据传递通常是整个系统性能的瓶颈。特别是在高速通信中,至少有两个参与者(生产者和消费者)需要访问相同的数据,因此存储接口通常是限制因素。因此,已经提出了许多解决方案,例如片上网络,共享存储器的集群,存储器层次结构等,以将数据从一个参与者转移到另一个参与者。为了避免使用双端口存储器宏(这在芯片面积方面是昂贵的),我们提出了一种硬件设计,其中将通过FIFO进行的通信透明地分割为多个更改的存储体。这允许在仅使用单个端口存储器宏的同时访问同一FIFO,从而减少了片上面积和访问延迟。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号