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Investigation of Various GeF4 Gas Mixtures for Improvement of Germanium Ion Implantation

机译:各种GeF 4 气体混合物改善锗离子注入的研究

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Germanium implant is commonly used in advanced semiconductor device manufacturing as one of the major material modification steps. Germanium Tetrafluoride (GeF4) is almost exclusively used as the primary source gas and its impact on ion source performance (poor source lifetime due to fluorine-induced halogen cycle) is well known. Our previous studies have demonstrated that mixing GeF4 with hydrogen (H2) can reduce the halogen cycle impact and prolong the source life as well as increase the beam current [1, 2]. In this work, we further investigated GeF4 mixed with other candidates such as inert, hydride and fluorohydride gases (e.g. Xe, N2, GeH4 and CH3F). Ge+ beam current performance and source effects were examined and compared with pure GeF4 and previously reported GeF4/H2 mixtures.
机译:锗植入物通常用作高级半导体器件制造中的主要材料改性步骤之一。四氟化锗(GeF 4 )几乎完全用作主要的源气体,并且它对离子源性能的影响(由于氟诱导的卤素循环而导致的源寿命很短)是众所周知的。我们以前的研究表明,混合GeF 4 与氢(H 2 )可以减少卤素循环的影响,延长源寿命,并增加电子束电流[1、2]。在这项工作中,我们进一步研究了GeF 4 与其他候选气体混合,例如惰性气体,氢化物气体和氟化氢气体(例如Xe,N 2 ,GeH 4 和CH 3 F)。通用电器 + 检查束电流性能和源效应并将其与纯GeF进行比较 4 和先前报道的GeF 4 /H 2 混合物。

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