Study on Ultrasonic Assisted Chemical Debonding Process

摘要

With the development of electronic products, the demand for mobile phone applications based on thin wafers and thin package thickness is increasing, lead to higher requirement for thin wafer processing in manufacturing steps. To ensure safe wafer handling, temporary de-bonding technology is required, which can be classified as thermal mechanical de-bonding, chemical de-bonding, UV de-bonding and laser de-bonding. In this paper, we focus on ultrasonic enhanced chemical de-bonding process. Influence of process parameters on de-bonding ability, residue of bonding material and wafer broken were studied in detail. This study adopts de-bonding process which use ultrasonic to accelerating chemical solution exchange. The effect of ultrasonic power and soaking time on infiltration of the de-bonding solution were investigated. Experimental result show that different ultrasonic power and soaking time have great effects on the speed of chemical solution, also it can be concluded that chemical de-bonding is an effective method for bonding process.