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Preparation and Characterization of Al2O3-AgNP hybrids for Application in Thermally Conductive Polymer Composites

机译:Al 2 O 3 -AgNP杂化材料的制备与表征

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With the fast development of the integrated circuit towards high density, miniaturization, multifunctionalization, heat management become one of the top priority issues to be addressed. Owing to excellent physical and chemical properties, especially excellent flexibility, polymers have wide applications in electronic. Nevertheless, most polymers possess thermal conductivity below 0.5 W/mK, which cannot meet the requirement in modern electronics with high power density and high speed. Conventionally, thermally conductive fillers are used to enhance the polymers’ thermal conductivity. Unfortunately, the enhancement of thermal conductivity is limited even at the high-volume fractions of filler (50% in volume). Herein, we report on an effective approach to preparing Al2O3-AgNP hybrids liquid-phase chemical reduction method. The Al2O3-AgNP hybrids consist of silver nanoparticles (AgNP) decorated aluminum oxide (Al2O3) microball. The structure and morphology of Al2O3-AgNP hybrids were confirmed. We demonstrated that the Ag nanoparticles with the size of 40–50 nm were uniformly decorated on the Al2O3surface, and the amount of Ag nanoparticles also can be tunable. We believe that this method has potential in preparing Al2O3-based polymer materials for application in thermally conductive polymer composites.
机译:随着集成电路向高密度,小型化,多功能化的快速发展,热管理已成为要解决的首要问题之一。由于优异的物理和化学性质,尤其是优异的柔韧性,聚合物在电子领域具有广泛的应用。然而,大多数聚合物的导热率低于0.5 W / mK,无法满足现代电子产品中具有高功率密度和高速度的要求。传统上,导热填料用于增强聚合物的导热性。不幸的是,即使在高体积分数的填料(体积百分比为50%)下,导热系数的提高也受到限制。在此,我们报告了一种制备Al的有效方法 2 Ø 3 -AgNP杂化物液相化学还原法。铝 2 Ø 3 -AgNP杂物由银纳米颗粒(AgNP)装饰的氧化铝(Al 2 Ø 3 )微球。 Al的结构和形态 2 Ø 3 -AgNP杂种被证实。我们证明了大小为40–50 nm的Ag纳米颗粒均匀地装饰在Al上 2 Ø 3 表面,Ag纳米粒子的数量也可以调整。我们认为该方法具有制备铝的潜力 2 Ø 3 于导热聚合物复合材料的聚合物基材料。

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