Corrosion mechanism in metallization systems for printed circuit boards

摘要

This paper presents and discusses the results for electrochemical corrosion testing in comparison to mixed flow gas testing (MFG) and salt spray testing for metallization systems of printed circuit boards. High resolution microstructural analyses are giving evidence for the running corrosion mechanism. We will show results of Scanning Electron Microscopy (SEM) and element analyses (EDS) for samples after standard testing and after applying an electrochemical test method. Additionally, also black pad formation will be studied by microstructural analyses and electrochemical testing.