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Advanced metrology by offline SEM data processing

机译:通过离线SEM数据处理实现高级计量

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Today's technology nodes contain more and more complex designs bringing increasing challenges to chip manufacturing process steps. It is necessary to have an efficient metrology to assess process variability of these complex patterns and thus extract relevant data to generate process aware design rules and to improve OPC models. Today process variability is mostly addressed through the analysis of in-line monitoring features which are often designed to support robust measurements and as a consequence are not always very representative of critical design rules. CD-SEM is the main CD metrology technique used in chip manufacturing process but it is challenged when it comes to measure metrics like tip to tip, tip to line, areas or necking in high quantity and with robustness. CD-SEM images contain a lot of information that is not always used in metrology. Suppliers have provided tools that allow engineers to extract the SEM contours of their features and to convert them into a GDS [1]. Contours can be seen as the signature of the shape as it contains all the dimensional data. Thus the methodology is to use the CD-SEM to take high quality images then generate SEM contours and create a data base out of them. Contours are used to feed an offline metrology tool that will process them to extract different metrics. It was shown in two previous papers [2, 3] that it is possible to perform complex measurements on hotspots at different process steps (lithography, etch, copper CMP) by using SEM contours with an in-house offline metrology tool. In the current paper, the methodology presented previously will be expanded to improve its robustness and combined with the use of phylogeny [4] to classify the SEM images according to their geometrical proximities.
机译:当今的技术节点包含越来越复杂的设计,给芯片制造工艺步骤带来了越来越多的挑战。有必要进行有效的度量,以评估这些复杂模式的过程可变性,从而提取相关数据以生成过程感知的设计规则并改善OPC模型。如今,过程可变性主要通过分析在线监控功能来解决,这些功能通常设计为支持可靠的测量,因此并不总是很能代表关键的设计规则。 CD-SEM是芯片制造过程中使用的主要CD计量技术,但要大量测量并具有鲁棒性,当测量尖端到尖端,尖端到线,面积或颈缩等度量标准时,它就面临挑战。 CD-SEM图像包含很多信息,这些信息并非总是用于计量学中。供应商提供了工具,使工程师可以提取其特征的SEM轮廓并将其转换为GDS [1]。轮廓可以看作是形状的标志,因为它包含所有尺寸数据。因此,该方法是使用CD-SEM拍摄高质量图像,然后生成SEM轮廓并从中创建数据库。等高线用于提供离线计量工具,该工具将对其进行处理以提取不同的度量。先前的两篇论文[2,3]表明,可以通过内部离线测量工具使用SEM等高线,在不同的工艺步骤(光刻,蚀刻,铜CMP)上对热点进行复杂的测量。在当前的论文中,先前介绍的方法将被扩展以提高其鲁棒性,并结合系统发育[4]根据其几何邻近度对SEM图像进行分类。

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