Investigation on the suitability of electrically conductive adhesives for die-attachment of power devices

摘要

In this work, we present our first results on the suitability of electrically conductive adhesives for die-attachment of power devices. Commercial and prototype adhesives were tested with respect to their shear strength and mechanical reliability after temperature shock tests. Furthermore their electrical properties and thermal conductivity were tested and compared to SnAg soldered modules. For these investigations "state-of-the-art" power devices like IGBT and diodes were mounted on DBC substrates. It was found out that the adhesives achieved high shear strength. Even after 1500 temperature shock tests (-40/150 °C) the shear force reduces only slightly. Some of the adhesives have sufficient electrical properties up to currents of 3.5 A/mm2. These are promising results for die-attachment of power devices.