Adhesion improvement of Thick Printed Copper film on alumina substrates by controlling of oxygen level in furnace

机译：通过控制炉中的氧气含量来改善氧化铝基板上厚铜印刷膜的附着力

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This paper deals with an adhesion measuring of samples prepared by prospective TPC (Thick Printed Copper) technology. The TPC technology is used for power electronic substrate manufacturing. Copper film is screen printed on alumina substrate and fired in nitrogen atmosphere. Oxygen level dependence on adhesion of copper film to alumina base and copper film solderability was observed in this paper.

机译：本文介绍了通过前瞻性TPC（厚印刷铜）技术制备的样品的粘附力测量。 TPC技术用于功率电子基板的制造。铜膜丝网印刷在氧化铝基板上，并在氮气氛中烧制。本文观察到氧水平取决于铜膜对氧化铝基的粘附性和铜膜的可焊性。

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《International Spring Seminar on Electronics Technology》|2016年|22-26|共5页
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Jiri Hlina; Karel Hromadka; Jan Reboun; Martin Hirman; Ales Hamacek;
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关键词
Copper; Adhesives; Firing; Substrates; Films; Springs; Seminars;

机译：铜;粘合剂;烧结;基材;薄膜;弹簧;研讨会;

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1. Substrate Bias Voltage Tailoring the Interfacial Chemistry of a-SiCx:H: A Surprising Improvement in Adhesion of a-C:H Thin Films Deposited on Ferrous Alloys Controlled by Oxygen [J] . Crespi Angela E., Leidens Leonardo M., Antunes Vinicius, ACS applied materials & interfaces . 2019,第19期

机译：衬底偏置电压剪裁A-SiCX的界面化学：H：A-C：H薄膜粘附的令人惊讶的改善：H沉积在氧气控制的黑色合金上的薄膜
2. Electric, magnetic and high frequency properties of screen printed ferrite-ferroelectric composite thick films on alumina substrate [J] . Patil N., Velhal N. B., Pawar R., Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe . 2015,第1期

机译：氧化铝基板上丝网印刷铁氧体-铁电复合厚膜的电，磁和高频特性
3. Dielectric Properties of Low-Firing Bi_2Mo_2O_9 Thick Films Screen Printed on Al Foils and Alumina Substrates [J] . Weihong Liu, Hong Wang, Di Zhou, International Journal of Applied Ceramic Technology / Functional Ceramics . 2010,第8期

机译：铝箔和氧化铝基底上丝网印刷的低火Bi_2Mo_2O_9厚膜的介电性能
4. Adhesion improvement of Thick Printed Copper film on alumina substrates by controlling of oxygen level in furnace [C] . Jiri Hlina, Karel Hromadka, Jan Reboun, International Spring Seminar on Electronics Technology . 2016

机译：通过控制炉中氧水平的氧化铝基材上厚印刷铜膜的粘附改善
5. Film-substrate interactions in yttrium(1) barium(2) copper(3) oxygen(7-x) superconductor thin films deposited on oxide and alkaline earth fluoride substrates. [D] . Peters, Christopher Harry. 1993

机译：钇（1）钡（2）铜（3）氧（7-x）超导体薄膜中的膜-基底相互作用，沉积在氧化物和碱土金属氟化物基底上。
6. Quantifying Oxygen Levels in 3D Bioprinted Cell-Laden Thick Constructs with Perfusable Microchannel Networks [O] . Lara Figueiredo, Catherine Le Visage, Pierre Weiss, 2020

机译：用可灌流的微通道网络量化3D生物打印的带有细胞的厚结构中的氧气水平
7. Screen printed La2/3Sr1/3MnO3 thick films on alumina substrates [O] . Durand L., Balcells i Argemí Lluís, Calleja Lázaro Alberto, 1998

机译：在氧化铝基板上丝网印刷La2 / 3Sr1 / 3MnO3厚膜
8. Interaction of Thick Film Dielectric,Conductor,and Alumina Substrate for DCU201Aircraft Controller. [R] . white, s. s. 1978

机译：DCU201飞机控制器厚膜介质，导体和氧化铝基板的相互作用。

Adhesion improvement of Thick Printed Copper film on alumina substrates by controlling of oxygen level in furnace

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