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A combined wafer bonding method using spin-coated water glass adhesive layer and spot pressing bonding technique

机译：利用旋涂水玻璃粘合剂层和点压结合技术的晶片结合方法

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摘要

A combined wafer bonding method consist of spot pressing bonding technique and water glass adhesive layer is proposed. The mechanism of water glass bonding is investigated, and the two major factors in this bonding method: surface energy and voids formation has also been discussed.

机译：提出了一种由点压结合技术和水玻璃粘结层组成的晶片结合方法。研究了水玻璃键合的机理，并讨论了该键合方法的两个主要因素：表面能和空隙的形成。

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《IEEE International Conference on Solid-State and Integrated Circuit Technology 》|2016年|260-262|共3页
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Yang Xu; Shengkai Wang; Yinghui Wang; Dapeng Chen; Honggang Liu;
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Heating systems; Silicon;

机译：加热系统;硅;

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专利

1. A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer [J] . Xu Yang, Wang Shengkai, Wang Yinghui, Japanese journal of applied physics . 2018 ,第2S1期

机译：使用点压键合技术和水玻璃粘合层的改进的低温晶圆键合方法
2. Corrigendum to 'An air-plasma enhanced low-temperature wafer bonding method using high-concentration water glass adhesive layer' [Appl. Surf. Sci. 500 (2020) 144007] [J] . Xu Yang, Wang Sheng-Kai, Yao Peilin, Applied Surface Science . 2021 ,第Mara1期

机译：使用高浓度水玻璃粘合剂层的勘探为“一种空中等离子体增强的低温晶片粘合法”[Appl。冲浪。 SCI。 500（2020）144007]
3. An air-plasma enhanced low-temperature wafer bonding method using high-concentration water glass adhesive layer [J] . Xu Yang, Wang Sheng-Kai, Yao Peilin, Applied Surface Science . 2020 ,第Jana15期

机译：使用高浓度水玻璃粘合剂层的空气等离子增强低温晶片粘合方法
4. A combined wafer bonding method using spin-coated water glass adhesive layer and spot pressing bonding technique [C] . Yang Xu, Shengkai Wang, Yinghui Wang, IEEE International Conference on Solid-State and Integrated Circuit Technology . 2016

机译：一种使用旋涂水玻璃粘合剂层的组合晶片键合方法和点压粘接技术
5. Damascene patterned metal/adhesive wafer bonding for three-dimensional integration. [D] . McMahon, J. Jay. 2008

机译：镶嵌图案化的金属/胶粘剂晶圆键合，用于三维集成。
6. Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding [O] . Simon J. Bleiker, Maaike M. Visser Taklo, Nicolas Lietaer, 2016

机译：通过胶粘晶圆键合为MEMS和成像传感器提供经济高效的晶圆级封盖
7. Capacitive pressure sensor with wafer-through silicon vias using SOI-Si direct wafer bonding and glass reflow technique [O] . Jun-Ku Kim, Chang-Wook Baek 2013

机译：电容式压力传感器采用SOI-Si直接晶圆键合和玻璃回流技术的晶片通过硅通孔通孔
8. Evaluation of the Adhesive Bonding Processes Used in Helicopter Manufacture. Part 4. Nondestructive Inspection of Adhesive Bonds Using Holographic Techniques. [R] . barbarisi, modesto j. chisholm,brian r. 1973

机译：直升机制造中粘接工艺的评价。第4部分：使用全息技术对粘合剂粘合剂进行无损检测。

A combined wafer bonding method using spin-coated water glass adhesive layer and spot pressing bonding technique

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