Electrical Analysis of High Temperature SAW Resonator Packages

摘要

This paper presents a study on the effects of package types and materials on the performance of high temperature SAW resonator based on GaPO4. Flip chip and wire bond package and interconnection with different materials have been considered. The studied materials for package include GaPO4 and AIN as insulator and Au, Pt, Ni, Au70/Pt30 as conductor. Analysis based on quasi-approximation of FDM shows that the flip chip is favorable for SAW resonator package due to less frequency shift when compared to wire bonding.