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Live, free, democratized electronics: Bridging catalyst of multi-disciplinary research

机译:实时,免费,民主化的电子产品:跨学科研究的桥梁催化剂

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Summary form only given. Computation and infotainment are the two major areas where Complementary Metal Oxide Semiconductor (CMOS) electronics have made major contributions. Moving forward we expect to see their dominance in automotive applications. At the same time, we are seeing increased interest in the area of Internet of Things (IoT) to connect trillions of sensors. We are preparing for Internet of Everything (IoE) applications where people, process, data and devices are going to be connected through new generation of electronics which are not possible today. Therefore, our research is focused on hybrid integration of heterogeneous materials, processes and devices to build free form (flexible, stretchable, reconfigurable in shape and size) interactive and high-performance electronics and systems for smart living and a sustainable future focusing on healthcare, water, food and environment. For scientific exploration, we develop integration strategy to make collective use of the materials, processes and device architecture leveraging multidisciplinary tracks of electrical engineering, material science, bioengineering, computer science and engineering, mechanical engineering, environmental engineering (focusing plants and marine science) and health science. As engineering tool, we use CMOS technology extensively due to its industrial relevance, maturity and reliability for rapid tech transfer. In my talk, I will discuss the advances we have made to make tomorrow's applications available today. Specifically I will be using some examples which are commercially relevant and/or under commercialization: (i) healthcare devices; (ii) 3D printed smart objects with embedded electronics; (iii) plug and play smart electronic platforms with integrated sensors and actuators and (iv) physically reconfigurable shape systems.
机译:仅提供摘要表格。计算和信息娱乐是互补金属氧化物半导体(CMOS)电子产品做出了重要贡献的两个主要领域。展望未来,我们希望看到它们在汽车应用中的主导地位。同时,我们看到对连接数万亿个传感器的物联网(IoT)领域的兴趣日益浓厚。我们正在为万物互联(IoE)应用做准备,在这些应用中,人们,流程,数据和设备将通过当今无法实现的新一代电子设备进行连接。因此,我们的研究重点是异构材料,工艺和设备的混合集成,以构建自由形式(灵活,可拉伸,形状和尺寸可重构)的交互式高性能电子产品和系统,以实现智能生活,并致力于医疗保健的可持续未来,水,食物和环境。为了进行科学探索,我们制定了整合策略,以利用电气工程,材料科学,生物工程,计算机科学与工程,机械工程,环境工程(聚焦植物和海洋科学)和健康科学。作为工程工具,由于其在工业上的相关性,成熟度和可靠性,我们广泛使用CMOS技术来进行快速技术转让。在我的演讲中,我将讨论我们为使明天的应用程序今天可用而取得的进步。具体而言,我将使用一些与商业相关和/或正在商业化的示例:(i)医疗设备; (ii)具有嵌入式电子设备的3D打印智能对象; (iii)具有集成传感器和执行器的即插即用智能电子平台,以及(iv)物理上可重新配置的形状系统。

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