Performance analyses on an advanced high-power diode packaging structures

摘要

This paper introduces two advanced high-power diode packaging designs, respectively named Z-type and A-type from the Zowie Technology Corp., and analyzes temperature and thermo-stress distributions in the two diode packaging structure. To this end, different currents were first provided to the experiments and temperatures on diode surfaces were recorded to extract suitable thermal convective coefficients. The followed simulations were performed and the mechanical behaviors of the two packaging designs are obtained. This paper finally compared the simulation results with discussions.