Fabrication of PCB Embedded 1200V/50A Power Module and Benchmarking with Commercial DBC-based Package

摘要

This paper presents a novel fabrication concept for PCB embedded power semiconductors. Here, the semiconductors are attached to an insulated metal substrate, which is embedded in a second step into an almost-ready PCB. This approach avoids handling of bare dies during PCB production. To demonstrate the feasibility of the concept, a 1200 V/50 A B6 bridge is designed and fabricated. The performance is evaluated and benchmarked. Compared to a conventional DBC-based power module, the conduction losses are reduced by 21% and the thermal resistance is reduced by 29%. Turn-off losses are 25% lower, while turn-on losses are about the same for both module types. A further optimization of the switching performance is possible, but requires a reduced DC-link inductance and an optimization of the gate resistance.