Mixed-Signal and Smart-Power Capable Hybrid Structured ASIC for Cost-Aware Single-Chip Integration of Industrial Applications

摘要

A new single-chip integration approach for industrial applications based on novel mixed-signal and smart-power capable hybrid structured ASIC is presented. The hybrid structured ASIC, offering low non-recurring engineering (NRE) costs of low-voltage (LV) structured ASICs as well as power electronic functionalities of cell based smart-power ICs, provides a cost-efficient integration platform for industrial applications. Based on the demonstrator chip fabricated in a 0.8micrometer high-voltage (HV) bipolar, CMOS, DMOS (BCD) silicon on insulator (SOI) process, construction of the hybrid structured ASIC is illustrated in detail and the applicability of the platform is successfully demonstrated.