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Mixed-Signal and Smart-Power Capable Hybrid Structured ASIC for Cost-Aware Single-Chip Integration of Industrial Applications

机译:具有混合信号和智能电源功能的混合结构化ASIC,适用于工业应用中意识到成本的单芯片集成

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摘要

A new single-chip integration approach for industrial applications based on novel mixed-signal and smart-power capable hybrid structured ASIC is presented. The hybrid structured ASIC, offering low non-recurring engineering (NRE) costs of low-voltage (LV) structured ASICs as well as power electronic functionalities of cell based smart-power ICs, provides a cost-efficient integration platform for industrial applications. Based on the demonstrator chip fabricated in a 0.8micrometer high-voltage (HV) bipolar, CMOS, DMOS (BCD) silicon on insulator (SOI) process, construction of the hybrid structured ASIC is illustrated in detail and the applicability of the platform is successfully demonstrated.
机译:提出了一种基于新型混合信号和具有智能电源功能的混合结构化ASIC的工业应用单芯片集成新方法。混合结构ASIC提供低压(LV)结构ASIC的非经常性工程(NRE)成本以及基于单元的智能功率IC的功率电子功能,从而为工业应用提供了经济高效的集成平台。基于在0.8微米高压(HV)双极,CMOS,DMOS(BCD)绝缘体上硅(SOI)工艺中制造的演示器芯片,详细说明了混合结构化ASIC的构造,并成功地实现了平台的适用性演示。

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