HCGM-based high-efficiency temperature evaluation scheme for NoCs

摘要

Temperature evaluation is a key point to the static power calculation and thermal management for application mapping. This paper proposes a design-time (offline) Heat Conduction Grid Model (HCGM) to evaluate the temperature of network-on-chip, which is based on the temperature dependency on heat flux density produced by ambient tiles as well as itself. This model incorporates short running time and high accuracy; reasonable temperature variation trend of each tile; high operability and consumability. Experimental results demonstrate that the proposed method can speedup the computation by around 184 times with accuracy decreased by 1.39% as compared to HotSpot.