基于温度感知任务调度的3D NoC混合拓扑结构

摘要

High power density of 3D NoC system is easy to cause on chip high temperature problem, which has a destructive effect on the system performance and chip reliability.Thermal aware task scheduling method mean to migrate hot task to relative cool task, but this way will increase the communication distance between the two node, and then has a destructive affection of overall performance.Therefor it needs to keep the original low communication overhead when using task migration met-hod.This paper proposed a hierarchical ring/mesh hybrid 3D NoC topology: RMH.This topology could balance the communication need and thermal need of 3D NoC system.RMH could keep original communication overhead when tasks migrated.The simulation results show that, compared to the traditional topology, the RMH topology can effectively alleviate the thermal problem, and reduces 31.1% of network latency on average.%3D NoC较高的功率密度容易造成温度过高,对系统性能和芯片可靠性造成负面影响.利用温度感知任务调度来控制节点温度的思路是在运行时把"热"节点上的任务迁移到"冷"节点上,这不可避免会出现迁移之后任务间通信距离变大进而影响整体性能.因此,在任务调度的过程中保持通信开销已经成为迫切需求.提出了分层次的ring/mesh 混合拓扑结构RMH,可以在任务迁移的同时保持原来较小的通信延迟.仿真结果表明,相比于3D NoC拓扑结构,RMH拓扑可以有效缓解散热问题,并且平均减少31.1%的网络延迟.