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8T-SRAM Cell with Improved Read and Write Margins in 65 nm CMOS Technology

机译:8T-SRAM单元采用65 nm CMOS技术改善了读写边距

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SRAM operation at subthreshold/weak inversion region provides a significant power reduction for digital circuits. SRAM arrays which contribute to a large amount of power consumption for the processors in sub-100 nm technologies, however, cannot benefit from subthreshold operation. To this end, new SRAM technique on the circuit or architecture level is required. In this chapter, a novel 8T-SRAM cell is proposed which shows a significant improvement in write margin by at least 22 % in comparison to the standard 6T-SRAM cell at supply voltage of 1 V. Furthermore, read static noise margin of the proposed cell is improved by at least 2.2X compared to the standard 6T-SRAM cell. Although by the use of the proposed SRAM cell, the total leakage power is increased for superthreshold region, the proposed cell is able to work at supply voltages lower than 200 mV through which the total power consumption and the robustness of the cell are improved significantly. The proposed circuit is designed in 65 nm CMOS TSMC technology.
机译:亚阈值/弱反转区域的SRAM操作可大幅降低数字电路的功耗。低于100 nm技术的SRAM阵列会给处理器带来大量功耗,但不能从低于阈值的操作中受益。为此,需要在电路或架构级别上使用新的SRAM技术。在本章中,提出了一种新颖的8T-SRAM单元,与在电源电压为1 V时的标准6T-SRAM单元相比,其写裕度显着提高了至少22%。此外,所提出的读静态噪声容限与标准的6T-SRAM单元相比,该单元至少提高了2.2倍。尽管通过使用所提出的SRAM单元,对于超阈值区域增加了总泄漏功率,但是所提出的单元能够在低于200mV的电源电压下工作,通过该电压可以显着改善单元的总功耗和鲁棒性。拟议的电路采用65 nm CMOS TSMC技术设计。

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