In this paper, we report on the influence of electrodeposition current density on the structural and magnetic properties of plated equiatomic CoPt magnetic thick films. Films are electroplated using constant current density, ranging 25–200 mA/cm, and subsequently annealed at 700°C for 40 min. It is found that electroplating current density has a strong influence over the plating rate, surface roughness, grain size, and order parameter. However, current density does not strongly affect the atomic composition of the plated film and only modestly influences the magnetic properties, namely coercivity. The films exhibit quasi-isotropic magnetic properties with the best results for a sample plated at 100 mA/cm, yielding H = 900 kA/m, and in-plane squareness of 0.95 for a 3-µm-thick film having an rms surface roughness of 20 nm.
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机译：在本文中，我们报道了电沉积电流密度对电镀的等原子CoPt磁性厚膜的结构和磁性的影响。使用恒定电流密度（范围为25–200 mA / cm）电镀膜，然后在700°C退火40分钟。发现电镀电流密度对电镀速率，表面粗糙度，晶粒尺寸和有序参数具有强烈影响。然而，电流密度不会强烈影响镀膜的原子组成，而仅会适度地影响磁性，即矫顽力。该膜表现出准各向同性的磁性，对于以100 mA / cm电镀的样品，结果最好，H = 900 kA / m，对于3 µm厚且具有均方根表面粗糙度的膜，其面内矩形度为0.95 20 nm。
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