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Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint

机译:ZrO 2 纳米颗粒对Sn 42 Bi 58 焊点力学性能的影响

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Lead-free solder has been used to replace toxic lead-containing solder. SnBi solder has attracted a lot of attention for its low-cost, low melting temperature. Nanoparticles, such as metallic, nonmetallic and oxidant, have been doped into solders to improve their performance. In this study, we investigated the effect of ZrO nanoparticles on the mechanical properties of SnBi solder joints. Firstly, solder balls were made from solder paste by stencil printing and reflow. Next, solder balls were reflowed to form solder joints on Cu pad metalized with Au/Ni layers. Then, solder joints were put into an isothermal aging oven for different aging time. Shear tests were performed to investigate the shear strength of both solder joints subjected to aging time. Scanning electron microscope (SEM) was employed to study microstructure evolution in solder matrix. The results showed that the shear strength of SnBi solder joints was reinforced with the incorporation of ZrO nanoparticles. The growth of intermetallic compounds (IMCs) in ZrO doped solder joints was observed to be impeded.
机译:无铅焊料已被用来代替有毒的含铅焊料。 SnBi焊料以其低成本,低熔化温度而备受关注。诸如金属,非金属和氧化剂之类的纳米颗粒已被掺入焊料中以改善其性能。在这项研究中,我们研究了ZrO纳米颗粒对SnBi焊点机械性能的影响。首先,焊锡球是通过模版印刷和回流焊由焊膏制成的。接下来,回流焊球以在用Au / Ni层金属化的Cu焊盘上形成焊点。然后,将焊点放入等温老化炉中进行不同的老化时间。进行了剪切测试,以研究两个焊点在老化时间下的剪切强度。扫描电子显微镜(SEM)用于研究焊料基体中的微观结构演变。结果表明,掺入ZrO纳米颗粒可增强SnBi焊点的剪切强度。观察到在掺杂ZrO的焊点中金属间化合物(IMC)的生长受到阻碍。

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