Effects of assembly process states on RF transmission properties in passive microstrip circuit

摘要

Assembly processing and state of micro-strip boards, such as splicing gap and soldering voiding, have significant influence on microwave transmission in microwave modules. Based on 3D electromagnetic simulated analysis, the influences of splicing gap and soldering voiding of micro-strip boards on properties of microwave transmission in S, X and Ku bands, such as insertion loss and voltage standing wave ratio (VSWR), were studied systematically. The results showed that insertion loss and VSWR rose when the splicing gap was enlarged, and this influence became stronger with the increase of RF signal frequency; the influence of splicing gap change on properties of signal transmission became stronger when the splicing gap became smaller, while it became weak when the signal frequency rose; with the increase of soldering voiding, insertion loss and VSWR of micro-strip line increased, but the variation of them were less than 0.15dB and 0.25 respectively, indicating that soldering voiding scarcely had influence on RF signal transmission in micro-strip lines.