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Design and simulation of 2.5 GHz system-in-a-package module

机译:2.5 GHz封装系统模块的设计和仿真

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This paper presents a new 2.5 GHz System in a package module. A new approach for S-parameters and RF power measurements of 2-port differential amplifiers is implemented. The new method is based on 2-port measurements of the output differential lines, while having the input ports fed with true differential base-band signals. The advantages of using this technique are several including eliminating the need to use 4-port vector network analyzers and baluns that are known to degrade measurements accuracy. The new design is validated by comparing simulation with measured data of the complete wireless system in a package (SiP) module operating at 2.5 GHz, which agreed quite well.
机译:本文在封装模块中提出了一个新的2.5 GHz系统。实现了一种用于2端口差分放大器的S参数和RF功率测量的新方法。新方法基于对输出差分线的2端口测量,同时使输入端口馈入真正的差分基带信号。使用该技术的优点有很多,包括无需使用已知会降低测量精度的4端口矢量网络分析仪和巴伦。通过将仿真与以2.5 GHz运行的封装(SiP)模块中的完整无线系统的测量数据进行比较,对新设计进行了验证,这非常吻合。

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