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Clustering of electronic circuit design modules for hardware-based and software-based co-simulation platforms

机译:基于硬件和基于软件的协同仿真平台的电子电路设计模块的集群

摘要

Approaches for preparing simulation models of an electronic circuit are disclosed. The design is partitioned into first and second clusters. The design includes a source module in the first cluster connected to a destination module in the second cluster. The first cluster is compiled into a first model for a software-based co-simulation platform for simulating behavior of the source module using the first model. The first cluster and the second cluster of the design are compiled into a second model for a hardware-based co-simulation platform that includes a programmable logic circuit configurable for emulating behavior of the design using the second model. An interconnection block is generated and stored in the second model. The interconnection block is switchable between coupling of the destination module in the second model to the source module of the first model or to a source module of the second model.
机译:公开了用于准备电子电路的仿真模型的方法。设计被划分为第一和第二集群。该设计包括第一群集中的源模块和第二群集中的目标模块。第一集群被编译成用于基于软件的协同仿真平台的第一模型,该平台用于使用第一模型来仿真源模块的行为。设计的第一集群和第二集群被编译为基于硬件的协同仿真平台的第二模型,该平台包括可配置为使用第二模型来仿真设计行为的可编程逻辑电路。生成互连模块并将其存储在第二模型中。互连块可在第二模型中的目的地模块到第一模型的源模块或第二模型的源模块的耦合之间切换。

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