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Thin-Silicon Injector (TSI): An All-Silicon Engineered Barrier, Highly Nonlinear Selector for High Density Resistive RAM Applications

机译:薄硅注入器(TSI):全硅设计的屏障,高度非线性选择器,用于高密度电阻RAM应用

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We report on a novel Thin-Silicon Injector (TSI) selector concept with bidirectional operation for high density resistive switching memory. Model-based analysis shows how the current drive-nonlinearity trade-off can be broken by properly combining physical material properties to enable decoupling control parameters of the current injection from those of selectivity. We demonstrate experimentally structures down to 40nm-size, featuring a high-drive current of ~1MA/cm, high current-voltage half-bias nonlinearity exceeding 6.10 at maximum current drive and very good reliability of >10cy endurance, with limited degradation of the selectivity. The selector has below 20nm thickness and it is fully implementable with readily available BEOL CMOS-compatible materials and processes.
机译:我们报告了一种新型的双向注入薄硅注入器(TSI)选择器概念,用于高密度电阻式开关存储器。基于模型的分析显示了如何通过适当地组合物理材料属性以使电流注入的控制参数与选择性的控制参数脱钩,从而打破电流驱动非线性折衷的问题。我们演示了实验结构,尺寸低至40nm,具有〜1MA / cm的高驱动电流,在最大电流驱动下超过6.10的高电流-电压半偏置非线性和非常好的可靠性(> 10cy耐力)以及有限的降级性能。选择性。该选择器的厚度小于20nm,并且可以通过与BEOL CMOS兼容的材料和工艺完全实现。

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