Package embedded decoupling capacitor impact on core power delivery network for ARM SoC application

摘要

In this paper, a BGA package having a ARM SoC chip is introduced, which has component-type embedded decoupling capacitors (decaps) for good power integrity performance of core power. To evaluate and confirm the impact of embedded decap on core PDN (power distribution network), two different packages were manufactured with and without the embedded decaps. The self impedances of system-level core PDN were simulated in frequency-domain and On-chip DvD (Dynamic Voltage Drop) simulations were performed in timedomain in order to verify the system-level impact of package embedded decap. There was clear improvement of systemlevel core PDN performance in middle frequency range when package embedded decaps were employed. In conclusion, the overall system-level core PDN for ARM SoC could meet the target impedance in frequency-domain as well as the target On-chip DvD level by having package embedded decaps.