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Extended wavelength InGaAs infrared detector arrays based on three types of material structures grown by MBE

机译:基于MBE生长的三种材料结构的扩展波长InGaAs红外探测器阵列

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Extended wavelength InGaAs infrared detector arrays in 1.0~2.5μm spectral rang based on three types of material structures grown by MBE were studied. The first type InGaAs detectors, marked by sample 1#, were fabricated using P-i-N epitaxial materials, mesa etching technique, side-wall and surface passivating film. The second type InGaAs detectors, marked by sample 2#, were fabricated using N-i-P epitaxial materials, mesa etching technique, side-wall and surface passivating film. The third type InGaAs detectors, marked by sample 3#, were fabricated using n-i-n epitaxial materials, planar diffusion process and surface passivating coating. Ⅰ-Ⅴ curves, low frequency noise and response spectra of these detectors were measured at the different temperature. The response spectra of these detectors cover 1.0~2.5μm wavelength range. The dark current density of three types InGaAs detectors are 28nA/cm~2, 2μA/cm~2, 9μA/cm~2 at 200K and -10mV bias voltage, respectively. Compared to Sample 2# and Sample 3#, sample 1# presents the lower dark current at the same temperature and the same bias voltage, which mainly results in the improvement of surface passivation film and the depth of mesa etching. The frequency spectrum of the noise of sample 1# has an inflection point at about 10Hz frequency, 1/f noise play an obviously role in the detectors below the 10Hz frequency.
机译:研究了MBE生长的三种材料结构在1.0〜2.5μm光谱范围内的扩展波长InGaAs红外探测器阵列。使用P-i-N外延材料,台面蚀刻技术,侧壁和表面钝化膜制造了以样品1#标记的第一类InGaAs检测器。使用N-i-P外延材料,台面蚀刻技术,侧壁和表面钝化膜制造了以样品2#标记的第二种InGaAs检测器。使用n-i-n外延材料,平面扩散工艺和表面钝化涂层制造了以样品3#标记的第三种InGaAs检测器。在不同温度下测量了这些探测器的Ⅰ-Ⅴ曲线,低频噪声和响应谱。这些探测器的响应光谱覆盖1.0〜2.5μm的波长范围。三种InGaAs检测器在200K和-10mV偏置电压下的暗电流密度分别为28nA / cm〜2、2μA / cm〜2、9μA / cm〜2。与样品2#和样品3#相比,样品1#在相同温度和相同偏置电压下呈现出更低的暗电流,这主要导致表面钝化膜的改善和台面蚀刻的深度。样品1#的噪声频谱在大约10Hz频率处有一个拐点,在10Hz以下的频率中,1 / f噪声在检测器中起着明显的作用。

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