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Challenges and opportunities in applying grapho-epitaxy DSA lithography to metal cut and contact/via applications

机译:在金属切割和接触/通孔应用中应用图形外延DSA光刻技术面临的挑战和机遇

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Directed self assembly has become a very attractive technology for Fin and contact/via applications. Some of the issues related to pattern placement error, defectivity rates and process integration are actively being addressed by the industry and have not faced significant roadblocks for contact-hole applications. While many DSA applications have been proposed, deploying DSA for Fin structures competes in cost and variability control with SADP techniques. Given the 1D nature of find structures, it is difficult to control fin placement with accuracy better than 4nm 3 sigma. In addition, a second patterning step is needed to remove the un-wanted sections of the grating and leaving behind only the required fin structures, therefore limiting its adoption. On the other hand, DSA applied to contact/via holes has demonstrated low defectivity rates due to improved polymerization and processing techniques, as well as an adequate control to reduce the placement error due to thermal fluctuations during the annealing and cylinder formation process. For that reason, the results from contact/via layers can extend to the metal cut layer printing with DSA grapho-epitaxy. In this paper, we show that DSA provides a promising cost-effective solution for the technolgy scaling by reducing mask number from N to N-1. It is shown that pxOPC may provide better guiding patterns than the conventional one. In addition, the practical grouping rules for DSA should avoid 2D grouping, avoid putting more than 3 features in a group with different pitches, and avoid grouping features with different sizes. Our recommendations to designers for DSA technology are the following: if the design is to be decomposed with 2 or more DSA masks, then the design rules should be set up in this way: first the minimum pitch is better to be on DSA material's own natural pitch; second, for each DSA mask, singletons and bar-like grouping shapes with DSA's natural pitch should be used as much as possible.
机译:定向自组装已成为Fin和接触/通孔应用中非常有吸引力的技术。与图案放置错误,缺陷率和工艺集成有关的一些问题已被业界积极地解决,并且在接触孔应用中并未遇到重大障碍。尽管已经提出了许多DSA应用程序,但为Fin结构部署DSA却与SADP技术在成本和可变性控制方面展开竞争。考虑到查找结构的一维性质,很难以高于4nm 3 sigma的精度来控制鳍的放置。另外,需要第二构图步骤以去除光栅的不需要的部分并且仅留下所需的鳍片结构,因此限制了其采用。另一方面,由于改进的聚合和加工技术,应用于接触/通孔的DSA已显示出较低的缺陷率,并且已进行了充分的控制以减少由于退火和圆柱形成过程中的热波动而引起的放置误差。因此,接触/通孔层的结果可以扩展到采用DSA石墨外延印刷的金属切割层。在本文中,我们展示了DSA通过将掩码数从N减少到N-1,为技术缩放提供了一种有前途的成本效益解决方案。结果表明,pxOPC可以提供比常规模式更好的引导模式。此外,DSA的实用分组规则应避免2D分组,避免在间距不同的组中放置3个以上的要素,并避免对不同大小的要素进行分组。对于DSA技术,我们对设计人员的建议如下:如果要使用2个或更多DSA蒙版分解设计,则应以这种方式设置设计规则:首先,最小间距最好取决于DSA材料自身的固有特性。沥青;其次,对于每个DSA蒙版,应尽可能使用具有DSA自然间距的单例和条状分组形状。

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