Microstructures producing method involves common stamping of contact opening and cut in ductile material layer, which is formed by substrate, where contact opening and cut correspond to structural components of metallizing structure

摘要

The method involves common stamping of a contact opening and a cut in a ductile material layer (103), which is formed by a substrate (101,151). The contact opening and the cut correspond to structural components of a metallizing structure of a microstructure component (100). A contact and a pathway are formed on the basis of the contact opening and the cut. The contact opening and the cut are filled with a conductive material.