Method for manufacturing of microstructure component, involves forming of material layer and another material layer by part of substrate, which is formed for manufacturing of microstructure component

摘要

The method involves forming of a material layer (104) and another material layer by a part of the substrate (101), which is formed for manufacturing of microstructure component (100). The former material layer formed by a conductive latter material layer (102) is optically probed. The tensioning characteristic of former material layer and latter material layer is estimated on the basis of an optical response, which is caused by the optical probing of former material layer. The latter layer consists of a semiconductor material. An independent claim is also included for a measuring system for estimating tensioning characteristics of microstructure components.