Low-cost 3D chip stacking with ThruChip wireless connections

摘要

This article consists of a collection of slides from the author's conference presentation on low cost 3D chip stacking with ThruChip's wireless connections. Some of the specific topics discussed include: the challenges of current 3D stacking methods; the deployment of wireless technologies from a cost and bandwidth perspective; advancements in wafer thinning; stacked wireless data communication; and power distribution facilities.