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Increasing emitter efficiency in 3.3-kV enhanced trench IGBTs for higher short-circuit capability

机译:提高3.3 kV增强沟槽IGBT的发射极效率,可用于更高的短路能力

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In this paper, a 3.3-kV Enhanced Trench IGBT has been designed with a high emitter efficiency, for improving its short-circuit robustness. The carrier distribution profile has been shaped in a way that it is possible to increase the electric field at the surface of the IGBT, and thereby, counteract the Kirk Effect onset. This design approach is beneficial for mitigating high-frequency oscillations, typically observed in IGBTs under short-circuit conditions. The effectiveness of the proposed design rule is validated by means of mixed-mode device simulations. Then, two IGBTs have been fabricated with different emitter efficiencies and tested under short circuit, validating that the high-frequency oscillations can be mitigated, with higher emitter efficiency IGBT designs.
机译:在本文中,设计了3.3 kV增强沟槽IGBT,具有高发射极效率,可提高其短路鲁棒性。载流子分配轮廓已经成形,以使得可以增加IGBT表面处的电场,从而抵消kirk效果爆发。这种设计方法有利于缓解高频振荡,通常在短路条件下在IGBT中观察到的高频振荡。通过混合模式设备模拟验证所提出的设计规则的有效性。然后,已经用不同的发射器效率制造了两种IGBT,并在短路下进行测试,验证高频振荡可以减轻高频振荡,具有更高的发射极效率IGBT设计。

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