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首页> 外文期刊>IEEE Transactions on Electron Devices >A Trench-Gate High-Conductivity IGBT (HiGT) With Short-Circuit Capability
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A Trench-Gate High-Conductivity IGBT (HiGT) With Short-Circuit Capability

机译:具有短路功能的沟槽栅高导通IGBT(HiGT)

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摘要

This paper describes a new 600-V trench-gate high-conductivity insulated gate bipolar transistor (trench HiGT) that has both a low collector–emitter saturation voltage of 1.55 V at 200 $ hbox{A/cm}^{2}$ and a tough short-circuit capability of more than 10 $muhbox{s}$. The trench HiGT also has better tradeoff relationship between turn-off switching loss and collector–emitter saturation voltage compared to either an insulated gate bipolar transistor (IGBT) with a planar gate or a conventional trench gate. A reverse transfer capacitance that is 50% lower than that of the planar-gate IGBT and an input capacitance that is 40% lower than that of a conventional trench gate IGBT have been obtained for the trench HiGT.
机译:本文介绍了一种新型的600V沟槽栅高导电绝缘栅双极晶体管(沟槽HiGT),其在200 $ hbox {A / cm} ^ {2} $时的集电极-发射极饱和电压低至1.55 V超过10美元/小时的强大短路能力。与具有平面栅极的绝缘栅双极晶体管(IGBT)或常规沟槽栅极相比,沟槽HiGT在关断开关损耗与集电极-发射极饱和电压之间也具有更好的权衡关系。对于沟槽HiGT,已经获得了比平面栅极IGBT的反向传输电容低50%的反向转移电容和比常规沟槽栅极IGBT的输入电容低40%的输入电容。

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