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Polymer micromachining based on Cu On Polyimide substrate and its application to flexible MEMS sensor

机译:基于Cu On Polyimide基体的聚合物微加工及其在柔性MEMS传感器中的应用

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As a way of making a variety of flexible MEMS sensors, we developed a process that uses a Cu On Polyimide (COP) substrate as a starting material and sacrificial Cu etching to produce a cavity and electrical feed-through structures on the substrate. The Cu etching characteristics of an iron (II) chloride solution were studied, and the results confirmed that etching in the depth and side directions strongly depended on the mask pattern and the etching time. A strip-shaped flexible thermal sensor was designed on the basis of the obtained etching results. One heater and two temperature sensors were designed for flow and acceleration sensors applications. The sensing metal on the polyimide thin membrane and the feed-through were successfully fabricated on the COP substrate.
机译:作为制造各种柔性MEMS传感器的一种方式,我们开发了一种工艺,该工艺使用Cu On Polyimide(COP)衬底作为起始材料,并进行牺牲Cu蚀刻,以在衬底上产生空腔和电馈通结构。研究了氯化铁(II)溶液的Cu蚀刻特性,结果证实了在深度和侧面方向上的蚀刻很大程度上取决于掩模图案和蚀刻时间。基于获得的蚀刻结果,设计了条形柔性热传感器。设计了一个加热器和两个温度传感器,用于流量和加速度传感器应用。在COP衬底上成功地制作了聚酰亚胺薄膜上的感应金属和馈通电极。

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