Studies on thermal properties of substrates for electronics using IR thermography

摘要

The evolution of electronics to higher and higher power levels have determined an increased interest for thermal management techniques. In this sense, the quantitative determination of thermophysical parameters for materials used in electronic packaging materials becomes very important. We present in the paper a method to determine thermal diffusivity (a) of materials used as substrates, using IR thermographical measurements. This is based on lateral or in-plane transient heat conduction and is inspired from work. The validation of the method was done using the well established measuring method called Flash diffusivity, but this can be applied only for some material samples. We will present results of measurements for rigid substrates (alumina and aluminum nitride).